Hexagonal boron nitride (h-BN) has excellent electrical insulation, excellent chemical stability and excellent dielectric properties.
Thermal performance. There is no obvious melting point, sublimation at 3000 ℃ in 01mpa nitrogen, melting point at 3000 ℃ in inert gas, heat resistance to 2000 ℃ in neutral reducing atmosphere, using temperature up to 2800 ℃ in nitrogen and argon, poor stability in oxygen atmosphere, using temperature below 1000 ℃.
Hexagonal boron nitride is one of the most thermally conductive materials in ceramic materials. Its thermal conductivity is ten times that of quartz, and it has a high thermal conductivity 60w/ (m · K) perpendicular to the c axis; The low thermal expansion coefficient, equivalent to quartz, is the smallest among ceramics. The thermal expansion coefficient in the c-axis direction is 41x10 ^-6/c, while in the d-axis direction is 2.3x10 ^-6/c, so the thermal shock resistance is very good.
