Cersol provides premium wafer clamping solutions engineered for both front-end and back-end semiconductor manufacturing. Our Wafer Porous Chucks—also widely recognized as "Anychuck" or "Vacuum Chucks"—are meticulously designed to provide secure, uniform, and ultra-flat vacuum holding for delicate substrates.

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Porous Ceramic Vacuum Chuck | Product Details

Porous Ceramic Vacuum Chuck

Multi-Specification Support Wafer Vacuum Chuck | Porous Ceramic Chuck

Adsorption Principle Comparison Wafer Vacuum Chuck

Partial Adsorption / No Leakage

Ensures stable vacuum pressure even when the wafer only covers a portion of the chuck surface. Ideal for handling multiple small parts simultaneously without the need for zone control.

High Flatness & Support

The micro-porous structure provides uniform support across the entire surface, preventing thin wafer deformation (dimples) commonly caused by traditional hole-based chucks.

Wear Resistance & Cleanliness

Highly durable ceramic material reduces particle contamination and resists chemical corrosion, making it perfect for cleanroom environments.

Customizable Pore Sizes

Available in various pore sizes (2μm to 100μm) to balance suction force and surface smoothness for specific process requirements.

Technical Specifications

Material	Alumina (Al₂O₃) / Silicon Carbide (SiC) Porous Ceramic
Average Pore Diameter	2μm / 10μm / 20μm / 100μm (Customizable)
Porosity	30% ~ 50%
Surface Flatness	< 5μm (Depending on total diameter)
Compatible Sizes	2", 4", 6", 8", 12" and Non-standard shapes
Typical Applications	Wafer thinning, dicing, cleaning, and inspection

Applications of the Porous Chuck

The Porous Chuck is an indispensable tool in high-precision manufacturing environments where delicate handling is paramount. Its primary applications include:

Semiconductor Processing: The Porous Chuck is widely used for wafer thinning (back-grinding), dicing, and CMP (Chemical Mechanical Planarization).
Optical Component Manufacturing: In the production of lenses and mirrors, the Porous Chuck provides stress-free mounting for ultra-precision grinding and polishing.
Thin-Film Metrology: When measuring thin-film thickness or surface topography, the Porous Chuck ensures the substrate remains perfectly flat without local deformation.
Flexible Electronics: Used for the temporary bonding and debonding of flexible substrates where traditional mechanical clamping would cause damage.

Manufacturing of the Porous Chuck

The performance of a Porous Chuck depends heavily on its material integrity and pore distribution. Our manufacturing process ensures premium quality:

Material Selection

We utilize high-purity Alumina or Silicon Carbide powders to create a Porous Chuck with high thermal stability and superior stiffness.

Precision Sintering

Advanced vacuum sintering techniques are applied to control the pore network, ensuring that the Porous Chuck has a uniform porosity of 30% to 50%.

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