Cersol delivers custom high-performance Silicon Nitride (Si3N4) substrates for modern power electronics. With superior fracture toughness (800 MPa) and thermal conductivity (>80 W/m·K), our solutions outperform Al2O3 and AlN in extreme environments.
A. Unmatched Mechanical Strength: Our Si3N4 substrates feature a typical 3-point bending strength of 800 MPa (Guaranteed >700 MPa), minimizing breakage risks during assembly.
B. High Thermal Performance: With a thermal conductivity of >80 W/m·K, our Si3N4 material dissipates heat efficiently, critical for high-density power devices.
C. Rugged Durability: A fracture toughness of >6.5 MPa·m^1/2 makes our Si3N4 ceramics incredibly resistant to crack propagation.
D. Thermal Compatibility: The CTE of 2.6 × 10⁻⁶/°C (20~200°C) is optimized to match Silicon chips, reducing thermal stress.
E. Chemical Stability: Cersol Si3N4 offers excellent resistance to chemical corrosion and wear.
Material: Silicon Nitride (Si3N4) Color: Off-White
At Cersol, we do not just sell standard plates; we provide comprehensive OEM (Original Equipment Manufacturer) services to fit your specific project requirements. We understand that advanced semiconductor packaging often requires unique geometries.
A. Custom Dimensions:
We manufacture Si3N4 substrates to your exact length, width, and thickness specifications.
B. Precision Processing:
Our Si3N4 manufacturing capabilities ensure tight tolerances on dimensions, warpage, and surface roughness.
C. Large Format Capability:
We are capable of producing large-sized Si3N4 master plates (e.g., up to 190mm x 138mm) which can be diced or processed according to your OEM needs.
D. Prototyping to Volume:
Whether you need a small batch of Si3N4 prototypes or high-volume OEM production, Cersol is your trusted partner.
Do not compromise on size. Let us build the Si3N4 substrate that perfectly fits your housing and circuit layout.
We believe in transparency. While Si3N4 is the premium choice for power electronics, customers often face specific challenges when adopting it. Here is how Cersol solves them.
A. The Disadvantage:
Silicon Nitride (Si3N4) is generally more expensive to manufacture than standard Alumina due to the high-temperature and high-pressure sintering process required.
B. The Cersol Solution:
We focus on Total Cost of Ownership (TCO). While the initial material cost is higher, the exceptional bending strength (800 MPa)
A. The Disadvantage:
With a Vickers hardness of 15 GPa
B. The Cersol Solution:
Cersol provides comprehensive OEM machining services. We utilize advanced laser processing and precision grinding to deliver ready-to-use Si3N4 substrates with tight tolerances (Warpage <0.45 mm, Ra 0.2-0.5 um)
A. The Disadvantage:
Aluminum Nitride (AlN) typically offers 170+ W/m·K, whereas Si3N4 is >80 W/m·K
B. The Cersol Solution:
Thermal conductivity is not the only factor in cooling. Because Si3N4 is so strong, it can be made thinner (e.g., 0.25 mm)
Here are answers to the most frequent inquiries regarding our Si3N4 technology.
Q: What is the thermal conductivity of Cersol Si3N4 substrates?
A: Cersol Si3N4 substrates feature a high thermal conductivity of >80 W/m·K
Q: How does Si3N4 compare to Alumina (Al2O3) and Aluminum Nitride (AlN) in terms of strength?
A: Silicon Nitride (Si3N4) is significantly stronger. Cersol Si3N4 has a typical bending strength of 800 MPa
Q: Can you customize the thickness and dimensions of the Si3N4 plates?
A: Yes. Our standard thicknesses are 0.32 mm and 0.25 mm
Q: What makes Si3N4 ideal for EV (Electric Vehicle) inverters?
A: The key is the thermal expansion coefficient (CTE). Cersol Si3N4 has a CTE of 2.6 ppm/°C
Cersol is dedicated to advancing ceramic technology. Our strict quality control over the Silicon Nitride (Si3N4) manufacturing process guarantees consistent performance batch after batch. By choosing Cersol, you gain a partner committed to delivering high-quality Si3N4 solutions tailored to your OEM specifications.
Ready to start your project? Contact us today for a consultation on your custom Si3N4 substrate needs.
