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Wafer End Effector

The Wafer End Effector, also known as a ceramic robot blade or vacuum wand, serves as the critical interface between the robotic handling system and the semiconductor wafer. Designed for high-speed, high-precision automated production lines, our end effectors are manufactured from high-purity Alumina (Al₂O₃) or Silicon Carbide (SiC). They are engineered to provide maximum rigidity and thermal stability, ensuring safe and particle-free wafer transport during critical manufacturing stages.

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Wafer End Effector

Product Gallery Wafer End Effector

High Rigidity & Lightweight

Utilizes AX-01 Multiphasic Alumina to achieve a high Young's modulus (200-300 GPa) while maintaining low mass. This ensures minimal vibration and tip deflection during high-speed robotic acceleration.

Ultra-Precise Surface Flatness

The contact surface is precision-ground to achieve exceptional flatness (up to < 0.01mm). This prevents micro-scratching on the wafer backside and ensures a perfectly uniform interface.

Wear Resistance & Cleanliness

The dense AX-01 ceramic (density > 4.10 g/cm³) significantly reduces particle generation compared to traditional metal effectors. It is chemically inert and ideal for ISO Class 1 cleanroom standards.

Thermal & ESD Stability

Features controlled volume resistivity (< 2.0*10¹ Ω·cm) to dissipate static charges. Its low thermal expansion (8.07 at RT~400°C) ensures dimensional stability during heat-intensive processes.

Technical Specifications

Model Number	AX-01
Color	Yellowish Brown (黄棕色)
Density (g/cm³)	> 4.10
Water Absorption (%)	0
Average Grain Size (μm)	0.2 (Range: 0.1-0.6)
Flexural Strength (MPa)	300 - 360
Poisson's Ratio	0.21
Young's Modulus (GPa)	200 - 300
Vickers Hardness (GPa)	11.31
CTE (RT~400°C, *10⁻⁶/°C)	8.07
Thermal Conductivity (W/m·k)	7.525 (at 25°C)
Volume Resistivity (Ω·cm)	< 2.0 * 10¹ (at RT)
Typical Applications	Products with conductivity requirements or specific volume resistivity needs.

Applications of the Porous Chuck

The AX-01 Wafer End Effector is an essential component for precision handling in modern semiconductor fabrication:

Vacuum Transfer Modules: Ideal for handling wafers in etch, lithography, and thin-film deposition chambers.
High-Temperature Processes: Maintains structural integrity during furnace loading and rapid thermal processing (RTP).
Wafer Metrology: Provides the vibration-free stability required for high-resolution inspection and thickness measurement.

Manufacturing of the Porous Chuck

Our manufacturing process ensures premium quality for every component:

Advanced Material Sintering

We control the grain size (averaging 0.2μm) to ensure uniform density and strength across the entire arm.

Precision Machining

Each effector is CNC-machined to strict tolerances to ensure compatibility with all major robot brands and wafer sizes (up to 300mm).

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