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Ceramic Sputtering Targets
Ceramic Sputtering Targets

Explore ceramic targets for display, photovoltaic and semiconductor thin-film applications. The range includes ITO, IGZO, oxide and nitride materials, with composition and dimensions reviewed against your process requirements. Contact Cersol for material selection and large-format target inquiries.

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Ceramic Targets

Ceramic targets provide source materials for thin-film deposition. Cersol welcomes inquiries for oxide, nitride and multi-component ceramic targets, with material composition, geometry and acceptance requirements reviewed for the intended coating process.

Material Range

Representative materials shown in the product brochure
Target family Materials
Multi-component oxides ITO (indium tin oxide), IGZO (indium gallium zinc oxide), indium zinc oxide
Single-metal oxides Aluminum oxide, magnesium oxide, nickel oxide, tin oxide, zinc oxide, yttrium oxide, titanium oxide and zirconium oxide
Nitrides Aluminum nitride and boron nitride
Functional ceramics Lead zirconate titanate (PZT)

Exact chemical composition, dopant ratio, phase and purity grade must be specified for each order. A material name alone does not define a qualified target specification.

Purity Control from Powder to Target

The supplied manufacturing brochure describes 5N-grade starting materials and powder preparation by microreactor co-precipitation. Resin-based slurry casting reduces contact with steel molds and other metallic tooling during forming.

The brochure reports powder purity at 5N level or higher and finished-product purity above 99.995%. These are distinct specifications: finished targets should not be described as universally 5N-purity products. Confirm applicability to the selected material, impurity basis and batch certificate before ordering.

Large-Format Planar Targets

The brochure reports production of single-piece targets up to 1550 mm in length. Larger formats above 1800 mm are described as a potential scale-up direction and require engineering review. Extra-wide and thicker targets for OLED production-line requirements are also described, with final dimensions subject to material and drawing confirmation.

Where a longer monolithic target replaces a segmented arrangement, fewer joints may be needed. Suitability depends on cathode design, installation interfaces and process conditions.

Manufacturing and Inspection

The described process combines powder preparation, resin slurry forming, atmospheric-pressure sintering and machining. Powder uniformity, solid-solution formation and grain consistency are manufacturing control objectives for stable sputtering performance.

Equipment and characterization methods listed in the brochure
Method Evaluation area
BET analysis Powder specific surface area
Laser particle-size analysis Powder particle-size distribution
X-ray diffraction (XRD) Crystalline phase characterization
ICP-OES Elemental analysis for the agreed test scope
Four-point probe Electrical characterization where applicable
Density measurement Target density evaluation
Magnetron sputtering equipment Deposition evaluation under agreed conditions

Available equipment does not imply that every test is included with every shipment. Agree sampling, test methods, acceptance limits and reporting before production.

Applications

  • Flat-panel displays: Target materials for display-related thin-film processes.
  • Photovoltaics: Material selection for compatible solar thin-film applications.
  • Semiconductor and memory processes: Composition-specific target inquiries for deposition requirements.
  • OLED manufacturing: Large-format target evaluation based on line and cathode requirements.

Application references describe market areas, not blanket qualification for every device or production tool.

Information Needed for a Quotation

  • Material formula, composition ratio, dopants and acceptable phase.
  • Purity requirement, impurity limits and certificate format.
  • Diameter or length, width, thickness, tolerances and drawing.
  • Density, electrical properties and surface requirements.
  • Backing plate, bonding and installation requirements, if applicable.
  • Sputtering system, process conditions, sample quantity and delivery needs.

No universal density, resistivity, dimensional tolerance or bonding specification is stated for this entire range. These values require confirmation for the selected target.

Frequently Asked Questions

Are all finished targets 5N purity?

No blanket 5N claim is made for finished targets. The brochure distinguishes 5N-level powder from finished-product purity above 99.995%. Material-specific limits and test evidence must be agreed for the order.

Is an 1800 mm target a standard stocked product?

No. The brochure reports single-piece production up to 1550 mm and describes further scaling beyond 1800 mm. Larger formats need a feasibility review.

Can the target be supplied with a backing plate?

Provide the backing-plate drawing, bonding requirement and operating conditions for evaluation. The supplied brochure does not establish a standard bonding service or specification.

Share your composition and drawing for a ceramic sputtering target inquiry.

Request Target Specifications
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